Plastronics was founded over 30 years ago for the exclusive purpose of designing, manufacturing and marketing high-quality burn-in sockets. Plastronics offers test and burn-in sockets for the all the latest packaged devices in hundreds of lead counts and body size options. Fully automated assembly lines for major products such as BGA and QFN gives customers a high-quality, cost-effective socket solution with quick time-to-market.
The types of products manufactured by Plastronics include BGA Sockets, BCC/CSP/LPCC/MLF/MLP/QFN Sockets, PGA (Micro PGA) Sockets, Land Grid Array (LGA) Sockets, Leadless Chip Carrier (LCC) Sockets, PLCC Sockets, Quad Flat Pack (QFP/TQFP) Sockets, Side Contacting (SO) Sockets, Lead Tip Contacting (SSOP) Sockets, and Small Outline J-Lead (SOJ) Sockets.
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