• My RFQ Activity
  • Cart
  • Register
  • |
  • |

Manufacturers

NexFlash Technologies - Winbond  Profile

Please click HERE to visit the official NexFlash Technologies - Winbond website

NexFlash Technologies - Winbond  Company Overview

NexFlash Technology, Inc. is a professional semiconductor company in the Silicon Valley. Its expertise is focused in Flash Memory technology and related products. NexFlash owns a variety of patents for high density Data Flash and Code Flash products.

NexFlash Technologies was acquired by Winbond in 2005.

Winbond Electronics Corporation was established in 1987 in the Hsinchu Science-based Industrial Park, Taiwan. Winbond is known for developing a broad range of products in two business groups: the Logic IC Business Group and the Memory IC Business Group.

The Logic IC Business Group is focused on three advantageous products lines - micro-controller-based consumer products, PC & PC peripheral ICs, and network access products.

The Memory IC Business Group is using best-in-class manufacturing processes to produce specialty DRAM, Flash Memory, and Pseudo SRAM products.

NexFlash Technologies - Winbond  Products

The types of products manufactured by NexFlash Technologies - Winbond include Voice & Speech ICs, MFID & RF-modules, Microcontrollers, Mobile Multimedia & Audio ICs, Small Home Electronics, Telecom ICs, Computer ICs, LAN Controllers, Super I/O Controllers, General Purpose I/O Controllers, Hardware Monitors, Clock Generators, Power Management Ics, Card Reader Ics, IEEE 1394 Controllers, EC & NB Keyboard Controllers, Memory Cards, USB Devices & Hubs, DRAM, Mobile RAM, Flash, EPROMs, Voice ICs, and Digital Potentiometers.

NexFlash Technologies - Winbond Datasheets

Search for datasheets by NexFlash Technologies - Winbond part number

DSCC National Stock Number (NSN) Search

Cross reference military-grade NexFlash Technologies - Winbond part numbers by National Stock Number.

QML/QPL Part Search

Cross reference military-grade NexFlash Technologies - Winbond products by QML or QPL qualification.

Standard Microcircuit Cross Reference

Cross reference military-grade NexFlash Technologies - Winbond products by SMD or MIL-M-38510 part number or specification.

Search for NexFlash Technologies - Winbond Products.

Click HERE to browse our Product Catalog or to search our live, realtime inventory database for the NexFlash Technologies - Winbond products you need.

  • Telephone
  • E-mail

Company News

Welcome!

Please let us know how we can help!

Industry News

  • Samsung Secures IoT Node-to-Cloud Samsung announced security spanning end nodes, gateways, and cloud services for its ambitious Artik platform for the Internet of Things.HERE
  • Spin Transfer, TEL Partner on MRAM Process Development MRAM hopeful, equipment vendor to collaborate to improve speed and performance of spin-transfer torque MRAM.HERE
  • Wafer Shipments Forecast to Rise Through 2019 After a record-setting 2016, shipments of blank silicon wafers are expected to reach new all-time highs in 2017, 2018 and 2019.HERE