Microelectronic Modules Corporation (MMC) manufactures surge protection modules for telecom applications and a variety of specialized modules on both ceramic and FR4 substrates for many industrial applications. MMC's chip on board assembly includes chip scale, flip chip and ball grid array (BGA) processes. MMC filed for protection under Chapter 11 of the Federal Bankruptcy Act in September, 2002 due to the sharp downturn in its telecom business. MMC's assets were acquired by Bourns Inc. in October, 2003. Bourns, Inc. serves a broad range of markets, including telecommunications, computer, industrial, instrumentation, automotive, consumer, audio, and medical.
The types of products manufactured by Microelectronic Modules - Bourns include Surge Protection Modules for Telecom application.
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